Virender Kumar

16+ years of experience designing printed circuit boards Skilled, self-motivated, and versatile Principal PCB Designer of multi-disciplined high-end technology PCB design layout and library creation, proven capable of solving complex PCB design issues and cad software problems.

Skills and Qualities
1. PCB Designing Using Cadstar16.0, Mentor Graphics PADS VX2.4, Xpedition, OrCad
17.2.
2. Quality Checks and Control for board design and Assembly related issues with checklist
3. Generating FAB Drawing and notes for fabrication of PCB and Assembly Drawing of
PCBs
4. Library Control and Management
5. Design review and QC
6. Suggesting to hardware designer for cost, BOM, Process optimization and quality
improvement
7. Interaction with mechanical designer for best fitment
8. Interaction with FAB houses for resolutions of FAB quarries
9. Coordination with hardware team to achieve project delivery on time accomplishments

Accomplishments
• Schematic entry in Cadstar16.0, OrCad 17.2, PADS Logic, DxDesigner, Xpedition
• PCB Designing Using Zuken Cadstar, Mentor Graphics PADS VX2.4, PCB Editor
• Stack-up Design
• Understanding of Circuit blocks and functioning, all types of SMD Packages.
• DFM, DFT, DFA
• EMI/EMC Consideration
• IPC Standard and IPC Certified Interconnect Designer
• SI/PI Verification
• Thermal Design Considerations
• Spice Simulation Tool, Circuit and PCB Simulation using hyperlynx
• Interface
• Bluetooth
• Wi-Fi
• I2C, I2S, SPI, RS232, RS485, RS422
• Ethernet, HDMI, SATA, LVDS, DDR2, DDR3

• Schematic entry in Cadstar16.0, OrCad 17.2, PADS Logic, DxDesigner, Xpedition
• PCB Designing Using Zuken Cadstar, Mentor Graphics PADS VX2.4, PCB Editor
• Stack-up Design
• Understanding of Circuit blocks and functioning, all types of SMD Packages.
• DFM, DFT, DFA
• EMI/EMC Consideration
• IPC Standard and IPC Certified Interconnect Designer
• SI/PI Verification
• Thermal Design Considerations
• Spice Simulation Tool, Circuit and PCB Simulation using hyperlynx
• Interface
• Bluetooth
• Wi-Fi
• I2C, I2S, SPI, RS232, RS485, RS422
• Ethernet, HDMI, SATA, LVDS, DDR2, DDR3
• USB2.0, USB3.0
• Differential Pair Signaling and Isolation
• Thermal Analysis
• Length matching for delay tuning
• Over-shoot, under- shoot and Cross-talk Simulation and Analysis
• Gerber Generation and Checking

Working as a Lead Engineer(PCB Layout) and collaborating communication between
Manufacturing team and Project management teams.
Provide pre and post engineering support in a fast paced and deadline oriented environment.
Part Creation, Schematic Design, PCB Layout Database, PCB Assembly Data, PCB Fabrication
Data,Layout Review and Quality Check Reports. Checklist and QC Reports.
Successfully designed multi-layered Printed Circuit boards (upto 12 layers) using CAD tools
such as Cadence Allegro, Mentor Graphics PADS.
Lead and work with CAD designers and Engineers and served as a technical Liaison between the
Mechanical Engineers and Project Engineers.
Expertise in Laying out High Speed, mixed signal and RF circuits along with High frequency
Power supply board design with reduced switching noise.
Performed DFM and DFT analysis and designed for Fabrication, Assembly and test as per the
latest IPC standards on Right and flex boards.