Packaging Designer - Bengaluru

This is a contract remote Packaging Designer role located in Bengaluru. The Packaging Designer will be responsible for creating and developing innovative functional and visually appealing packaging designs for various products. Daily tasks include brainstorming creative concepts ...

We are looking for a creative and detail-driven Sr Graphic Designer with 7-8 years of experience in the beauty industry specializing in packaging design for makeup bath & body and fragrances. · ...

We are looking for a creative and detail-oriented Graphic Designer with strong experience in package design, branding, and digital creatives. · ...

+We are seeking a talented Packaging Designer with proven expertise in CorelDRAW and a solid background in FMCG and D2C packaging design. · ...

We are looking for a creative and detail-oriented Packaging DesignerWe are looking for a creative and detail-oriented Packaging Designer to design innovative, · functional, · Competitive salary packageCareer growth and advancement ...

This contract Packaging Designer will create innovative packaging designs for various products. · ...

Design innovative packaging for pharmaceutical and food products. · ...

At Home Centre India, we're looking to elevate our packaging designs with a talented Graphic Designer. · The ideal candidate will have strong skills in Adobe Illustrator and Photoshop, as well as 3-5 years of design experience (with packaging expertise being a plus). · Create inn ...

We are looking for a Graphic Designer to work on packaging projects. · Create production-ready artworks using Adobe Illustrator and Photoshop. ...

We are looking for a skilled Graphic Designer with strong knowledge of print and packaging design. · The ideal candidate should understand print production processes and be able to create designs that are visually appealing as well as technically correct for printing. · Provident ...

+Join the Package Design Team at Cisco Silicon One in Armenia, shaping innovative methodologies and driving the evolution of high-performance networking technologies. · +Be part of package design tasks, planning and driving schedules from concept through implementation · Optimize ...

+As an IC package design engineer you will have good understanding of package/substrate design and package assembly rules related to flip chip designs. · +Experinec in IC Package Layout Design · Substrate Design · +,+ + , Good Exposure to Stackup design substrate DFM DFA rules ...

Join the Package Design Team at Cisco Silicon One in Armenia to make a significant impact on the future of networking innovation within the Cisco Silicon One initiative. As a lead engineer you will drive the entire package design process from planning and optimization to executio ...

Join the Package Design Team at Cisco Silicon One in Armenia, a group leading the way in developing Cisco's groundbreaking silicon solutions for next-generation networking. · ...

This role offers a unique opportunity to make a significant impact on the future of networking innovation within the Cisco Silicon One initiative. · ...

We are hiring for Design engineer · Contact us at please share your updated resumeCollaborate with sales and procurement teamsEvaluate designs for cost-effectiveness durability and sustainabilityLiaise with production teams ...

/b>The silicon packaging design engineer is responsible for the physical design of high-density package substrates for Intel SoCs. The role requires collaboration with multiple stakeholders and experience in leading at least two high-density flip chip interconnect-based package d ...

+This role offers a unique opportunity to make a significant impact on the future of networking innovation within the Cisco Silicon One initiative. · ...

+The engineer is responsible for the physical design of high-density package substrates for Intel SoCs. · +Working with Full chip/IP development teams to drive and plan optimal bump patterns, · Diving the substrate physical design reviews as per plan, · , ...

The engineer is responsible for the physical design of high-density package substrates for Intel SoCs. · The engineer must have a good understanding of flip chip interconnect based leading edge substrate design rules along with package assembly driven constraints and rules. · ...