Package Engineer - Bangalore Metropolitan Area, India - HCLTech

Description

IC Package Design Engineer

Job Location: Bangalore

Exp : 5 to 10 years

• IC Package Design, Substrate Design with Flip Chip and Wire bonds.
• Experience with IC Package Design using Mentor Graphics XPD, XSI tools and Cadence and Allegro APD.
• Good understanding of package/substrate design and package assembly rules related to flip chip and wire bond designs.
• Exposure to different package technologies such as MCM, SIP, SOC, 3D, 2.5D etc., added advantage.
• Hands-on expertise with PCB designs involving High Speed Parallel Bus interfaces including DDR x, GDDR and HSIO interfaces including PCIe GenX, SERDES.
• Good Exposure to Stackup design, DFM, DFA rules and adherence.
• Should possess good knowledge and codesign work experience on SI, PI, Mechanical and Thermal analysis.
• Expertise in High-Speed Complex PCB designs with HDI, Blind and Buried Via technologies.
• Should have expertise in constraint setting in layout tool.
• IC Package design/Substrate design experience is mandatory.
• Should be able to work with customer SPOC independently.
• Should have experience in all phases of Substrate and PCB design (from net-in to Gerber generation).