IC Package Layout Engineer - Hyderabad, India - Micron

    Micron
    Micron Hyderabad, India

    3 weeks ago

    Micron background
    Description

    Our vision is to transform how the world uses information to enrich life for all.

    Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

    JR46143 IC Package Layout Engineer
  • Key Responsibilities and Tasks:
  • Draft package layouts for design specifications.
  • Create PCB and IC Package Library (Footprint Creation).
  • Handle constraints-driven IC Package layout methodology.
  • Have a basic understanding of Signal Integrity and Power Integrity concepts.
  • Conduct layout reviews with internal layout and design teams.
  • Release IC Package layout drawings to various IC Package design teams and coordinate their layout activities, ensuring compliance with design rules.
  • Perform Design Rules Check (DRC) to ensure that the layout meets specific manufacturing and design guidelines.
  • Apply CAM350 Gerber validation tools for quality assurance.
  • Deliver accurate layout designs by having basic knowledge of Design for Manufacturing (DFM), Design for Assembly (DFA), and Design for Testing (DFT).
  • Possess proven oral and written communication skills to connect with partners and multi-functional teams.
  • Influence outcomes and drive initiatives in sophisticated environments.

    • Education, Experience and Qualification Required:

  • Diploma or bachelor's degree or equivalent experience in engineering (EEE/ECE).
  • Demonstrated ability in PCB and IC Package Layout Design.
  • Knowledge of electronics fundamentals and hands-on experience with layout tools such as Cadence APD Design guidelines, Constraints handling, Gerber generation, and CAM 350 CAM validation.
  • Experience in routing DDR5 memory interface, PCIe, UFS, GPIO, etc.
  • Experience in DDR, LPDDR, NAND, GDDR layout designs.
  • Solid understanding of SI (Signal Integrity) and PI (Power Integrity) routing guidelines.
  • Experience with sophisticated and multi-layer boards.
  • Solid understanding of high-speed routing guidelines.
  • Experience with Mentor Hyperlynx DRC rules for Signal Integrity and Power Integrity tools or similar.
  • Good communication and social skills, excellent learning and problem-solving ability.
  • Capable of working independently and as a team member, with good attention to detail.
  • Excellent analytical skills and organizational competency.
  • Good oral and written English communication skills.