Shashie Pawar

3 months ago · 1 min. reading time · visibility 0 ·

chat Contact the author

thumb_up Relevant message Comment

3D Integrated Circuit Market Size | Industry Research Report 2022

The rise in demand by semiconductor industry for high density and bandwidth, and low power solution, many IC designers are looking up for 3D ICs mounted with through silicon vias (TSVs). 3D ICs accommodate with multiple heterogeneous die such as logic, memory, analog, RF, and micro-electrical mechanical systems thereby improve performance and reduce cost. 3D ICs offers following advantages over traditional system on chips (SoC): low cost, easier to meet high interconnect speeds & bandwidth requirements, ideal for compact mobile devices, reduced resistance-inductance-capacitance helps in reducing power, emerging technologies such as MEMS can potentially be integrated into 3D stacks. 3D ICs with TSVs is showing huge opportunity for semiconductor industry. It offers compelling power, performance and form factor advantages and also can curb the escalating cost of SoC development. However, a well-defined ecosystem including foundries, IP providers, and vendors, need to emerge with more innovative design kits and reference flows


 

sPWsM.jpeg
thumb_up Relevant message Comment
Comments

More articles from Shashie Pawar

View blog
2 months ago · 1 min. reading time
Shashie Pawar S

Smart Connected Devices Market Poised to Expand at a Robust Pace Over 2023

The global smart connected devices market is proje ...

2 months ago · 1 min. reading time
Shashie Pawar S

Connected Car Market Foreseen To Grow Exponentially Over 2027

The global connected car market is predicted to ex ...

2 months ago · 1 min. reading time
Shashie Pawar S

Substation Automation Market Outlook & Forecast of Top Countries 2023

The global substation automation market is growing ...