Dinesh rkp

Dear Team,

I have 11 years of experience in high-performance PCB design, Cadence -Allegro 24.1 Ver I bring specialized expertise in board architecture (including stack-up design), schematic capture, and meticulous documentation control.

My skills encompass comprehensive parts list management, Design for Manufacturing (DFM) and Design for Assembly (DFA) analysis, EMI/EMC compliance, and proactive support throughout assembly and fabrication processes.

I thrive in B2B environments and cross-functional teams, consistently enhancing design efficiency and ensuring product reliability through collaborative problem-solving and process optimization.
Please find my resume attached for your review. I would welcome the opportunity to discuss how my experience aligns with your goals and how I can add value to your team.

Thank you for considering my application, and I am looking forward to hearing from you.

Best Regards,
Dinesh (RKP)
 

Professional Affiliations.

• 11+ years designing multilayer PCBs (up to 20 layers).
• Expertise in designing double‑sided and multilayer PCB boards, including high‑speed, mixed‑signal, RF, power boards, backplane cards, and both rigid and flex circuits.
• Proven ability to manage PCB projects independently and lead teams, effectively planning layer structures to meet design requirements.
• Skilled in HDI board design using a wide range of via technologies, including blind/buried vias, micro‑vias, stacked, staggered, PTH, and 4‑N‑4 vias.
• Proficient in length matching and component placement for interfaces such as DDR2, DDR3, DDR4,  Wi‑Fi, SDRAM, PCI, SATA, HDMI, USB, RJ45, CAN, SPI, RF, UART, and power PCBs.
• Experienced in pin‑pair and combination‑net length matching, DRC checking and clearing, Gerber file generation, and review.
• Expertise in plane splitting, power distribution, and routing critical signals including clock signals, differential pairs, buses, and single‑ended traces with noise considerations.
• Strong knowledge of fabrication and assembly processes, including Design for Assembly (DFA), Design for Manufacturing (DFM), and Design for Test (DFT).
• Effective collaborator with project teams, understanding circuit requirements and limitations to deliver optimized design solutions.
• Familiar with topology styles and arc routing for high‑frequency GHz signals.
• Consistently delivers projects on schedule, ensuring high‑quality results within timeline constraints.

Manufacturing Engineering Design / Supply Chain Management

• Proficient in 2D and 3D modeling software such as AutoCAD, Solid Edge, and equivalent tools.
• Experience working on cochlear implant designs, enhancing hearing capabilities for individuals with hearing loss.
• Skilled in generating CAM files such as Gerber, ODB++, and NC files, as well as creating BOMs, fabrication, and assembly drawings to support manufacturing processes.
• Responsible for creating and maintaining comprehensive documentation for CAM processes, manufacturing guidelines, and quality standards.
• Strong understanding of Design for Manufacturability (DFM) and Design for Assembly (DFA) principles to optimize production and reduce costs.
• Independently design PCBs and collaborate effectively with international engineering teams.
• Work closely with cross‑functional teams including electrical, mechanical, hardware engineers, PCB fabricators, and assembly teams to ensure seamless project execution.
• Proven ability to build relationships and engage stakeholders across B2B environments, supported by strong communication skills and the ability to interact with all business levels.

MBA in General Management (OnLine - Currently Pursuing)   – VIT University, Vellore, TN Advanced training in leadership, strategy, and global business management.

M.Sc. in Electronic Communication (2020) – Periyar University, Salem, TN Specialized knowledge in electronics, communication systems, and applied technology.