3Dic Flow Designer - Bengaluru, Karnataka, India - INTEL

INTEL

Verified Company

Bengaluru, Karnataka, India

2 weeks ago

Posted by:

Deepika Kaur

beBee Recuiter

Description

Participate in 3D IC reference design using Intel advanced 3D IC packaging processes to strategically promote Intel technologies to customers.

Participate in development of 3D IC physical design verification and validation flows (DRC and LVS) using commercial tools from vendors such as Synopsys, Cadence, Siemens, Ansys, etc.
Participate in development of thermal, mechanical, and electrical simulation methodology and flow using commercial tools from vendors such as Synopsys, Cadence, Siemens, Ansys, etc.
Participate in lab evaluation for prototype 3D IC reference design.
Crossfunctional interface with IC design, CAD/DAE, thermal and system/product teams.
Evaluate Intel foundry packaging technologies and propose areas of improvement to ensure Intel competitive edge; support internal and external customers to facilitate Intel technology enablement and customer solution development.

Qualifications:

Qualifications:

Minimum Requirements:

Bachelor of Science in Electrical Engineering or related fields.
Knowledge in analog and digital IC design basics.
Knowledge in semiconductor manufacturing, assembly, and packaging basics.
Excellent interpersonal, analytical, written, and verbal communication skills; strong team player.

Preferred Experiences in one or more items below:

Experiences in highspeed package or board design and layout.
Experiences in 2D and 3D simulation tools for extracting package layout models for power integrity and signal integrity (PI and SI) analysis.
Experiences with PI and SI simulation flow and methodology.
Experiences with Intel Foveros and EMIB technologies.
Experiences with advanced chiplet design with multiple dies such as HBM's, GPU's and CPU's.
Experiences with 2D, 2.5D and/or 3D packaging integration design.
Familiar with various packaging technologies such as BGA, fcCSP, WLCSP, systeminpackage SiP, multichip modules MCM, wirebond, heterogenous integration, AiP, AoP, SoC Solder ball, Cu pillar, hybrid, thermocompression, and bonding techniques.
Familiar with packaging knowledge that includes SMT, flip chip, bonding, molding, underfill, dispense, EMI shielding, lid, and solder ball attach.
OSAT or foundry 2.5D or 3D packaging design experience.
Experiences with thermal analysis and thermal measurement at die and package levels.

Inside this Business Group:

Intel Foundry Services (IFS) is an independent foundry business that is established to meet our customers' unique product needs.

With the first "Open System Foundry" model in the world, our combined offerings of wafer fabrication, advanced process, and packaging technology, chiplet, software, robust ecosystem, and assembly and test capabilities help our customers build their innovative silicon designs and deliver full end-to-end customizable products from Intel's secure, resilient and sustainable source of supply.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Benefits:

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.

Working Model:

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site.

In certain circumstances the work model may change to accommodate business needs.
JobType

Hybrid